Our Story
Key Capabilities Include:
• Device design and design for manufacturability
• Extensive volume manufacturing experience, including SQC/SPC – ISO 9001 certified
• Superior tool set for all aspects of wafer processing
• Sub-micron photolithography to 0.3µm
• Wafer-level bonding (glass frit, eutectics, anodic, fusion, polymer) for device encapsulation and microfluidic construction
• Hermetic wafer-level packaging with vacuum, atmospheric, and specialty gases
• Isolated metal-filled through-silicon vias (50 micron diameter, 250 microns deep)
• Deep reactive ion etching (DRIE), RIE, wet etching, and ion milling
• Electroplating of thick films (> 50 micron) using photoresist mask
• Chemical-mechanical polishing (CMP), including wafer thinning/grinding
• Unmatched metrology tools and experience